G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages StdPbc-0718 本ガイドは，MEにおける化学反応によるF-GHGの消費，残留，副生成物，組み換えについての特性評価に適用される。

本ガイドは，MEにおける化学反応によるF-GHGの消費，残留，副生成物，組み換えについての特性評価に適用される。

The purpose of this document is to provide a guide for evaluation of chemical-mechanical polishing (CMP) processes of thin films on unpatterned silicon substrates

light) will address the performance and reliability for OPV/DSSC/PSC device

이 개정판 발행은 2011년 5월 13일 Global Audits & Reviews Subcommittee에 의해 승인되었다

SEMI E140-0312 (technical revision)

G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages StdPbc-0718 本ガイドは，MEにおける化学反応によるF-GHGの消費，残留，副生成物，組み換えについての特性評価に適用される。This document is a guideline for ordering the tooling required to manufacture plastic semiconductor packages. These packages include the following JEDEC registered outlines: Plastic Dual in Line Packages (PDIP); Plastic Leaded Chip Carrier (PLCC); Plastic Quad Flat Packages (PQFP); Small Outline I. C. Packages (SOIC Gull Wing and "J" lead); and Plastic TAB Quad Packages (PTAB)Title. Referenced SEMI Standards SEMI G48 Specification, Measurement Method