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BS EN IEC 61189-2-801. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801. Thermal conductivity test for base materials not-eligible Contactless integrated circuit

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Contactless integrated circuit

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The specification information included in this document is applicable only when the design guidance in PD 6702-1 has been followed

BS EN IEC 61189-2-801. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801. Thermal conductivity test for base materials not-eligible Contactless integrated circuit

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